Prix FOB
Obtenir le dernier prix10 ~ 40 USD / Kilogram ( Negotiable )
|50 Kilogram Minimum Order
Pays:
Hong Kong
N ° de modèle:
-
Prix FOB:
10 ~ 40 USD / Kilogram ( Negotiable ) Obtenir le dernier prix
Localité:
China
Prix de commande minimale:
10 per Kilogram
Commande minimale:
50 Kilogram
Packaging Detail:
customize
Heure de livraison:
10 days
Capacité de Fournir:
200 Ton per Week
Payment Type:
T/T
Groupe de produits :
Personne àcontacter Ms. Moqi
6/F MANULIFE PLACE 348 KWUN TONG ROAD, hongkog, hongkong
Adhesive series for chip ceramic
components
Ceramic component
molding adhesive materials are ceramic capacitors, ceramic
inductors, ceramic buzzers, ceramic substrates, ceramic filters,
ceramic sensors, ceramic microwave devices, etc.Temporary adhesive
before ceramic components are sintered into porcelain.With special
powder dispersant, it has ultra-thin ductility, denseness, good
elasticity, small deformation, high accuracy and less sintered ash
residue and other characteristics.It is used in two-step
ingredients (porcelain powder, solvent, additives according to the
proportion.Add it to the equipment for mixing and dispersion, and
then add additives and molding agents for a second mix dispersion),
used for the production of ceramic capacitors, ceramic inductors,
ceramic urn filters, ceramic sensors, ceramic microwave devices,
etc., ingredients for dispersible powder or thinner medium film
makingprocess.
| Pays: | Hong Kong |
| N ° de modèle: | - |
| Prix FOB: | 10 ~ 40 / Kilogram ( Negotiable ) Obtenir le dernier prix |
| Localité: | China |
| Prix de commande minimale: | 10 per Kilogram |
| Commande minimale: | 50 Kilogram |
| Packaging Detail: | customize |
| Heure de livraison: | 10 days |
| Capacité de Fournir: | 200 Ton per Week |
| Payment Type: | T/T |
| Groupe de produits : | electronic components |
