Prix FOB
Obtenir le dernier prix( Negotiable )
|1 Piece Minimum Order
Pays:
China
N ° de modèle:
-
Prix FOB:
( Negotiable ) Obtenir le dernier prix
Localité:
china
Prix de commande minimale:
-
Commande minimale:
1 Piece
Packaging Detail:
box
Heure de livraison:
5-10days
Capacité de Fournir:
3000 Piece per Month
Payment Type:
D/A, L/C, T/T
Groupe de produits :
-
Personne àcontacter Mr. Anna
Zhengzhou,Henan,China, Zhengzhou, Henan
Silicon wafer back grinding wheels are
mainly used for the thinning and fine grinding of the silicon
wafer.
Coolant: Oil, emulsion
whatsapp *********8/***3
workpiece processed: silicon wafer of
discrete devices, integrated chips (IC) and
virgin,ATM, Melchiorre, Peter Wolters, Diskus,
Viotto, Wendt
Material of workpiece: monocrystalline
silicon and some other semiconductor materials.
Specifications
1.be used with Japanese, German, American,
Korea and Chinese grindersÂ
2.superior grinding
performanceÂ
3.high cost performance
Â
Â
| Shape code | Profile Sketch | Conventional Specification (mm) | ||
| Out diameter D |
Thickness T |
Hole diameter H | ||
| 6A2 | Â | **5 | *0, *5 | *6 |
| **0 | *5 | *6 | ||
| **5 | *0 | **7 | ||
| 6A2T | Â | **5 | *2.5, *5 | **0 |
| **0 | *0 | **8.6 | ||
| **0 | *5 | **5 | ||
| 6A2T- | Â | **9 | *2.5 | **8 |
| Pays: | China |
| N ° de modèle: | - |
| Prix FOB: | ( Negotiable ) Obtenir le dernier prix |
| Localité: | china |
| Prix de commande minimale: | - |
| Commande minimale: | 1 Piece |
| Packaging Detail: | box |
| Heure de livraison: | 5-10days |
| Capacité de Fournir: | 3000 Piece per Month |
| Payment Type: | D/A, L/C, T/T |
| Groupe de produits : | - |
