Silicone thermal conductive pad with 1.2~8w gap filler pad for CPU GPU heat sink By Shenzhen Sky ever Technology Co,
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Silicone thermal conductive pad with 1.2~8w gap filler pad for CPU GPU heat sink Silicone thermal conductive pad with 1.2~8w gap filler pad for CPU GPU heat sink Silicone thermal conductive pad with 1.2~8w gap filler pad for CPU GPU heat sink Silicone thermal conductive pad with 1.2~8w gap filler pad for CPU GPU heat sink Silicone thermal conductive pad with 1.2~8w gap filler pad for CPU GPU heat sink
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Silicone thermal conductive pad with 1.2~8w gap filler pad for CPU GPU heat sink

( Negotiable )

|

1 Piece Minimum Order

Pays:

China

N ° de modèle:

TP

Prix FOB:

( Negotiable ) Obtenir le dernier prix

Localité:

China

Prix de commande minimale:

-

Commande minimale:

1 Piece

Packaging Detail:

Box and carton

Heure de livraison:

7-15 working days after payments

Capacité de Fournir:

10000 Piece per Month

Payment Type:

PayPal, Western Union, T/T

Groupe de produits :

Contacter maintenant
Membre gratuit

Personne à contacter Ms. Jenny

Guanlan, Shenzhen, Guangdong

Contacter maintenant

Spécification du produit

  • Type: thermal pad
  • Material : silicone rubber
  • Application: CPU GPU heat sink etc
  • Color:white, grey
  • Thermal conductivity:1.2~8w/m-k
  • Thickness:0.3~15mm
  • Size:200*400mm,300*400mm,can die-cutting as you required
  • Other:can be with strong adhesive, fiberglass coated, silicone clo

La description

As for thermal conductive pad we have several types

 

 

1. Normal type: 1.2w/m-k,

 

2.High thermal conductivity type: 2w/m-k~4w/m-k,

 

3.Ultra-high thermal conductivity type: 5w/m-k~8w/m-k,

 

4.Thermal pad with silicone cloth,

 

5.Thermal pad with fiberglass,

 

6.Thermal pad with strong adhesive like 3M adhesive

 

 

 

 

 

TP**0 is one kind of basic thermal conductive pad.Silicone type with soft rubber material.Thermal silicone pad is a very cost-effective general economic thermal gap filling gasket, soft with its own micro-stick, easy assembly.

 

Under low compressing force to show good thermal conductivity and electrical insulation properties. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full contact forming a continuous thermal conduction.Using heat sink or machine shell as a cooling device can effectively increase the cooling area to achieve a good cooling purposes.

 

 

 

 



























































 
 

Test item

 

Test method

 

Unit

 

TP**0

 

Color

 

 

 

 

 

Grey/white

 

Thickness

 

ASTM D**4

 

mm

 

0.3~*5

 

Specific gravity

 

ASTM D**2

 

g/cm³

 

1.8

 

Hardness

 

ASTM D***0

 

Shore C

 

*0~*5

 

Temperature endurance

 

EN**4

 

℃

 

**0~***0

 

Voltage endurance

 

ASTM D**9

 

KV/mm

 

>5.0

 

Flame rating

 

UL**4

 

 

 

V*0

 

Conductivity

 

ASTM D***0

 

w/m-k

 

1.2

 



Tips:



1.The original size is **0mmx**0mm, **0mmx**0mm and it is decided by the machine.However, it can die-cut to any size by machine again. So we can offer you the different size you need.



2.As for color, the general is grey and white.If you need other color,please tell me.



3.As for thermal conductivity,if you need others,also please let me know.

 

 

 

 

Usage


 

 

 Step 1

 

Clear the surface where you are going to paste the thermal pad; 

 

 

 

 

 

 Step2

 

Tear the protective film of one side and remember do not tear the protective film of both sides in the same time to reduce the contact times and scare of the thermal pad avoiding the damage of thermal pad stickiness and thermal conductivity. 

 



 

 

 Step3

 

Paste the side without protective film on the products, then tear the other side protective film, then install your electronic components on the thermal pad. After installation, press slightly and let it stay for a while to ensure the thermal pad fixed well. 

 

 

 

 

 

 

 

Application 

 

 

 

Graphic/video card/memory           High-speed hard disk driver                    Memorymodule South and North Bridge

 

 

 



Heat sink of micro heat tube       Control device of car engine                               Mobile phone 

 

     

 

 

 

Portable electronic devices           New energy car electronic device                     Led lighting

 

 

 





If you are interested in this type or need other types pls do not hesitate to contact me for more details.

 

 

 

Sky-ever welcome your inquiry !

 
 

Pays: China
N ° de modèle: TP
Prix FOB: ( Negotiable ) Obtenir le dernier prix
Localité: China
Prix de commande minimale: -
Commande minimale: 1 Piece
Packaging Detail: Box and carton
Heure de livraison: 7-15 working days after payments
Capacité de Fournir: 10000 Piece per Month
Payment Type: PayPal, Western Union, T/T
Groupe de produits : Thermal interface material

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To:

Ms. Jenny < Shenzhen Sky ever Technology Co >

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