PCB Gold-Plated Board

La description

Our pcb fabric capacity:
1 Layer: ***4 Layers
2 Base Material for PCB: FR*4,CEM*1,CEM*3,FR*1,FR*2,Aluminum metal substrate and Rogers
3 Finishing Treatment Type: HASL/HAL,HAL-lead free,Flux,Carbon-bridge,Entek,Nickel plating,osp,ENIG(Immersion Gold),Gold Plating (Flash Gold), OSP, etc.
4 finish boards Thickness: 0.**2.4mm
5 Max size of finish board: **0MM***0MM
6 Minimum Linewidth/space: 3mil (0.**5mm)
7 Minimum drilled hole size: 0.**5mm
8 Min space between pad to pad: 3mil (0.**5mm)
9 Minimun thickness of soldermask: *0um
*0 Tolerance:outline tolerance±0.1mm,Hole diameter tolerance±0.**6mm,Hole location tolerance±0.**6mm,V-cut tolerance±0.1mm
*1 Max proportion of drilling hole and board thickness: 1:*2.5
*2 copper foil thickness:*8um(H/HOZ),*5um(1/1oz),*0um(2/2oz),5oz
*3 Average hole wall copper:Thickness for HAL board ≥*5um,Gold-finger plating ≥0.1um
*4 outline:punch,routing,V-cut,reveling
*5 Soldermask ink:photo cure ink,heat cure ink,uv ink
*6 Color of silk-screen: White, Black, Yellow ect.
*7 Turnover: US $*******0
*8 Export:*0%**0%
*9 Warp:according to the IPC***0F standard
*0 Special technological requirement: Blind & Buried Vias and High Thickness copper
*2 Product range: Flex-PCB,Rigid-PCB,Flex-rigid PCB,HDI PCB ,PCB of single,Double and Multi-layers,High frequency PCB ,etc