❯

BOOK A CALL

Book Call On Your Favorite Time

I'm a Buyer I'm a Supplier

By Signing Up. I agree to TradeKey.com Terms of Use, Privacy Policy, IPR and receive emails related to our services

multilayer Ceramic PCB

Prix FOB

Obtenir le dernier prix

10 ~ 30 / Piece

3 Piece Minimum Order

Pays:

China

N Â° de modÃ¨le:

Prix FOB:

10 ~ 30 / Piece (Negotiable) Obtenir le dernier prix

LocalitÃ©:

china

Prix de commande minimale:

10 per Piece

Commande minimale:

3 Piece

Packaging Detail:

Heure de livraison:

Capacité de Fournir:

100000 Piece per Month

Payment Type:

T/T, L/C, PayPal, Other

Groupe de produits :

Contacter maintenant

Hitech Circuits Co., Limited

China

Membre gratuit

Personne Ã contacter Fiona

Shenzhen, Guangdong

Contacter maintenant

La description

1. Alumina PCB (*2% AI2O3)
Alumina is the most popular ceramic material for multilayer packages. In constant use and development for years, its performance is well-characterized, with a proven track record.
Alumina offers high strength, good thermal conductivity, hermeticity, excellent electrical properties and the lowest cost high density interconnect.
2. Aluminum Nitride (AlN) PCB
Due to its high thermal conductivity and excellent Coefficient of Thermal Expansion (CTE) match to silicon, aluminum nitride is the ceramic material of choice for high heat dissipation and/or large chip applications. Aluminum nitride is produced using hot press technology. Ideal for applications requiring very high thermal conductivity (**0W/mK). The patented hot press process allows precision tolerances(±0.*5%)

1. Alumina PCB (*2% AI2O3)
Alumina is the most popular ceramic material for multilayer packages. In constant use and development for years, its performance is well-characterized, with a proven track record.
Alumina offers high strength, good thermal conductivity, hermeticity, excellent electrical properties and the lowest cost high density interconnect.
2. Aluminum Nitride (AlN) PCB
Due to its high thermal conductivity and excellent Coefficient of Thermal Expansion (CTE) match to silicon, aluminum nitride is the ceramic material of choice for high heat dissipation and/or large chip applications. Aluminum nitride is produced using hot press technology. Ideal for applications requiring very high thermal conductivity (**0W/mK). The patented hot press process allows precision tolerances(±0.*5%)

Pays:	China
N Â° de modÃ¨le:	-
Prix FOB:	10 ~ 30 / Piece (Negotiable) Obtenir le dernier prix
LocalitÃ©:	china
Prix de commande minimale:	10 per Piece
Commande minimale:	3 Piece
Packaging Detail:	-
Heure de livraison:	30
Capacité de Fournir:	100000 Piece per Month
Payment Type:	T/T, L/C, PayPal, Other
Groupe de produits :	-