Prix FOB
Obtenir le dernier prix|
- Minimum Order
Pays:
China
N ° de modèle:
-
Prix FOB:
Localité:
-
Prix de commande minimale:
-
Commande minimale:
-
Packaging Detail:
-
Heure de livraison:
-
Capacité de Fournir:
-
Payment Type:
PayPal, Other
Groupe de produits :
-
Personne àcontacter Rena
Shenzhen, Guangdong
Mobile Phone FPC
1. Camera module (BGA) uses cover layer production process to
replace solder mask ink production process, improving work
efficiency, shortening production process flow, and increasing
volume production yield to more than *5%.
2. By equipment replacement and technical breakthrough, it can
produce fine line with 0.*5mm width/distance in batches.Â
3. Product diversification: Batch production of single sided and
double sided plates, impedance plates, BGA, LCD, backlights, hollow
plates, multi-layer boards, rigid-flexible PCB, gold-plating/
aluminum-plating products.
The company owns FPC full-process production equipment, and can
produce chemical nickel/ gold plating, nickel/ gold electroplating,
pure tin electroplating and immersion tin by surface treatment.
| Pays: | China |
| N ° de modèle: | - |
| Prix FOB: | Obtenir le dernier prix |
| Localité: | - |
| Prix de commande minimale: | - |
| Commande minimale: | - |
| Packaging Detail: | - |
| Heure de livraison: | - |
| Capacité de Fournir: | - |
| Payment Type: | PayPal, Other |
| Groupe de produits : | - |
