Prix FOB
Obtenir le dernier prix0.1 ~ 10 /
|100 Piece Minimum Order
Pays:
China
N ° de modèle:
tws_1102
Prix FOB:
0.1 ~ 10 / Obtenir le dernier prix
Localité:
SHENZHEN
Prix de commande minimale:
0.1
Commande minimale:
100 Piece
Packaging Detail:
vacuumize and carton box, all depend on your requirement
Heure de livraison:
4 days for sample and within 2 weeks for batch
Capacité de Fournir:
100000 Piece per Month
Payment Type:
T/T, Western Union
Groupe de produits :
Personne àcontacter Mr. Henry
7/F (Office), Tower G, Block 1, Jinganghuating, West of Bao'an Road, Xixiang Street, Shenzhen, Guangdong
| Â |
Specification Inch (mm)Â |
||
|
Material |
FR*4 / Hi Tg FR*4 / Lead free Materials (RoHS Compliant) /CEM*3/CEM*1/Aluminium |
||
|
Layer No. |
***0 |
||
|
Board thickness |
0.**5"(0.4mm)*0.**5"(3.2mm) |
||
|
 |
|||
|
Board Thickness Tolerance |
±*0% |
||
|
Cooper thickness |
1/2OZ*3OZ |
||
|
Impedance Control |
±*0% |
||
|
Warpage |
0.**5%*1.5% |
||
|
Peelable |
0.**2"(0.3mm)*0.*2’(0.5mm) |
||
|
Â
 |
|||
|
Min Trace Width (a) |
0.**5"(0.**5mm) |
 |
|
|
Min Space Width (b) |
0.**5"(0.**5mm) |
||
|
Min Annular Ring |
0.**5"(0.**5mm) |
 |
|
|
SMD Pitch (a) |
0.**2"(0.3mm) |
 |
|
|
BGA Pitch (b) |
0.**7"(0.**5mm) |
||
|
Regesiter torlerance |
0.*5mm |
||
|
  |
|||
|
Min Solder Mask Dam (a) |
0.**5"(0.**5mm) |
 |
|
|
Soldermask Clearance (b) |
0.**5"(0.**5mm) |
||
|
Min SMT Pad spacing (c) |
0.**4"(0.1mm) |
||
|
Solder Mask Thickness |
0.***7"(0.**8mm) |
||
|
  |
|||
|
Hole size |
0.*1"(0.*5mm)*- 0.**7"(6.5mm) |
||
|
Hole Size Tol (+/-) |
±0.**3"(±0.***2mm) |
||
|
Aspect Ratio |
6:1 |
||
|
Hole Registration |
0.**4"(0.1mm) |
||
|
Plating
|
|||
|
HASL |
2.5um |
||
|
Lead free HASL |
2.5um |
||
|
Immersion Gold |
Nickel **7um Au:**3u'' |
||
|
OSP |
0.**0.5um |
||
|
Outline
|
|||
|
Panel Outline Tol (+/-) |
±0.**4''(±0.1mm) |
||
|
Beveling |
*0°*5° |
||
|
V-cut |
*5° *0° *5° *0° |
||
|
Certificate |
ROHSÂ ISO***1:***0Â TS****9Â SGS Â UL |
||
| Â |
Specification Inch (mm)Â |
||
|
Material |
FR*4 / Hi Tg FR*4 / Lead free Materials (RoHS Compliant) /CEM*3/CEM*1/Aluminium |
||
|
Layer No. |
***0 |
||
|
Board thickness |
0.**5"(0.4mm)*0.**5"(3.2mm) |
||
|
 |
|||
|
Board Thickness Tolerance |
±*0% |
||
|
Cooper thickness |
1/2OZ*3OZ |
||
|
Impedance Control |
±*0% |
||
|
Warpage |
0.**5%*1.5% |
||
|
Peelable |
0.**2"(0.3mm)*0.*2’(0.5mm) |
||
|
Â
 |
|||
|
Min Trace Width (a) |
0.**5"(0.**5mm) |
 |
|
|
Min Space Width (b) |
0.**5"(0.**5mm) |
||
|
Min Annular Ring |
0.**5"(0.**5mm) |
 |
|
|
SMD Pitch (a) |
0.**2"(0.3mm) |
 |
|
|
BGA Pitch (b) |
0.**7"(0.**5mm) |
||
|
Regesiter torlerance |
0.*5mm |
||
|
  |
|||
|
Min Solder Mask Dam (a) |
0.**5"(0.**5mm) |
 |
|
|
Soldermask Clearance (b) |
0.**5"(0.**5mm) |
||
|
Min SMT Pad spacing (c) |
0.**4"(0.1mm) |
||
|
Solder Mask Thickness |
0.***7"(0.**8mm) |
||
|
  |
|||
|
Hole size |
0.*1"(0.*5mm)*- 0.**7"(6.5mm) |
||
|
Hole Size Tol (+/-) |
±0.**3"(±0.***2mm) |
||
|
Aspect Ratio |
6:1 |
||
|
Hole Registration |
0.**4"(0.1mm) |
||
|
Plating
|
|||
|
HASL |
2.5um |
||
|
Lead free HASL |
2.5um |
||
|
Immersion Gold |
Nickel **7um Au:**3u'' |
||
|
OSP |
0.**0.5um |
||
|
Outline
|
|||
|
Panel Outline Tol (+/-) |
±0.**4''(±0.1mm) |
||
|
Beveling |
*0°*5° |
||
|
V-cut |
*5° *0° *5° *0° |
||
|
Certificate |
ROHSÂ ISO***1:***0Â TS****9Â SGS Â UL |
||
| Â |
Specification Inch (mm)Â |
||
|
Material |
FR*4 / Hi Tg FR*4 / Lead free Materials (RoHS Compliant) /CEM*3/CEM*1/Aluminium |
||
|
Layer No. |
***0 |
||
|
Board thickness |
0.**5"(0.4mm)*0.**5"(3.2mm) |
||
|
 |
|||
|
Board Thickness Tolerance |
±*0% |
||
|
Cooper thickness |
1/2OZ*3OZ |
||
|
Impedance Control |
±*0% |
||
|
Warpage |
0.**5%*1.5% |
||
|
Peelable |
0.**2"(0.3mm)*0.*2’(0.5mm) |
||
|
Â
 |
|||
|
Min Trace Width (a) |
0.**5"(0.**5mm) |
 |
|
|
Min Space Width (b) |
0.**5"(0.**5mm) |
||
|
Min Annular Ring |
0.**5"(0.**5mm) |
 |
|
|
SMD Pitch (a) |
0.**2"(0.3mm) |
 |
|
|
BGA Pitch (b) |
0.**7"(0.**5mm) |
||
|
Regesiter torlerance |
0.*5mm |
||
|
  |
|||
|
Min Solder Mask Dam (a) |
0.**5"(0.**5mm) |
 |
|
|
Soldermask Clearance (b) |
0.**5"(0.**5mm) |
||
|
Min SMT Pad spacing (c) |
0.**4"(0.1mm) |
||
|
Solder Mask Thickness |
0.***7"(0.**8mm) |
||
|
  |
|||
|
Hole size |
0.*1"(0.*5mm)*- 0.**7"(6.5mm) |
||
|
Hole Size Tol (+/-) |
±0.**3"(±0.***2mm) |
||
|
Aspect Ratio |
6:1 |
||
|
Hole Registration |
0.**4"(0.1mm) |
||
|
Plating
|
|||
|
HASL |
2.5um |
||
|
Lead free HASL |
2.5um |
||
|
Immersion Gold |
Nickel **7um Au:**3u'' |
||
|
OSP |
0.**0.5um |
||
|
Outline
|
|||
|
Panel Outline Tol (+/-) |
±0.**4''(±0.1mm) |
||
|
Beveling |
*0°*5° |
||
|
V-cut |
*5° *0° *5° *0° |
||
|
Certificate |
ROHSÂ ISO***1:***0Â TS****9Â SGS Â UL |
||
| Pays: | China |
| N ° de modèle: | tws_1102 |
| Prix FOB: | 0.1 ~ 10 / Obtenir le dernier prix |
| Localité: | SHENZHEN |
| Prix de commande minimale: | 0.1 |
| Commande minimale: | 100 Piece |
| Packaging Detail: | vacuumize and carton box, all depend on your requirement |
| Heure de livraison: | 4 days for sample and within 2 weeks for batch |
| Capacité de Fournir: | 100000 Piece per Month |
| Payment Type: | T/T, Western Union |
| Groupe de produits : | LED pcb |
