Castable up to 1 inch thicknesses
Rapid cures at elevated temperatures
Superior dimensional stability
Exceptional electrical isolator Unlimited working
life at room temperature
Kohesi Bond KB ***3 RLV is a true single component system
that requires no mixing and cures hard at elevated
temperatures. Although it requires a minimum temperature
of **0°C for curing (at which it cures extraordinarily
fast), it can achieve even faster cures at elevated
temperatures. KB ***3 RLV offers an extensive serviceable
temperature range of **0°C to ***0°C. This products
exquisite flow properties makes it ideal for use in
underfill, potting and encapsulation applications. Being
a one component system, it provides ease of application
and also adheres well to an encyclopedic variety of
substrates including metals, ceramics, most plastics and
glass. It provides sterling mechanical strength
properties and dimensional stability. KB ***3 RLV offers
phenomenal thermal conductivity of 1 1.2 W/m/K. In
addition to superior electrical insulation, KB ***3 RLV
also offers astounding chemical resistance to a variety
of fuels, oils and water. It has a light yellow color,
but it can be color matched to your specifications upon
request. With a unique combination of remarkable
performance, ease of use and excellent mechanical
strength properties, KB ***3 RLV is widely used in
electronics and microelectronics packaging and assembly
applications.
TYPICAL
APPLICATIONS : Underfill,  Potting,  Encapsulation, Sealing,
Coating
Industrial Certification :Â RoHS
Compliant
