Prix FOB
Obtenir le dernier prix20 ~ 200 /
|500 Minimum Order
Pays:
Hong Kong
N ° de modèle:
-
Prix FOB:
20 ~ 200 / Obtenir le dernier prix
Localité:
-
Prix de commande minimale:
20
Commande minimale:
500
Packaging Detail:
-
Heure de livraison:
-
Capacité de Fournir:
-
Payment Type:
T/T
Groupe de produits :
-
China
Personne àcontacter Jason
Futian stree, Shenzhen, Guangdong
The part is available in a small, **-pin SOIC package with an integrated metal heat sink in the base of the device that ensures adequate heat dissipation in even the most demanding environments. Measuring only 0.5 x 0.4 inches, and only 0.1 inch thick, the HI****3 offers the smallest board footprint available for this function, and is small enough even for PCMCIA applications.
The devices may be used with standard MIL-STD****3 transformers with a 1:2.5 turns ratio for direct coupled and 1:1.*9/1:1.4 turns ratios for transformer coupled bus connections.
Samples of the HI****3 and HI****4 are readily available in the small thermally enhanced plastic SOIC as well as in the traditional **-pin ceramic DIP package.
| Pays: | Hong Kong |
| N ° de modèle: | - |
| Prix FOB: | 20 ~ 200 / Obtenir le dernier prix |
| Localité: | - |
| Prix de commande minimale: | 20 |
| Commande minimale: | 500 |
| Packaging Detail: | - |
| Heure de livraison: | - |
| Capacité de Fournir: | - |
| Payment Type: | T/T |
| Groupe de produits : | - |
