High Frequency PCB Rogers 60mil 1.524mm RO4350B Double Sided RF Circuit Board Patch Antenna PCB

High Frequency PCB Rogers 60mil 1.524mm RO4350B Double Sided RF Circuit Board Patch Antenna PCB

Prix FOB

Obtenir le dernier prix

9 ~ 99 / Unit ( Negotiable )

1 Piece Minimum Order

Pays:

China

N Â° de modÃ¨le:

BIC-001-V1.0

Prix FOB:

9 ~ 99 / Unit ( Negotiable )(Negotiable) Obtenir le dernier prix

LocalitÃ©:

China

Prix de commande minimale:

9 per Unit

Commande minimale:

1 Piece

Packaging Detail:

vaccume

Heure de livraison:

10 working days

Capacité de Fournir:

50000 Piece per Month

Payment Type:

T/T

Groupe de produits :

Contacter maintenant

Bicheng Electronics Technology Co., Ltd

China

Membre gratuit

Personne Ã contacter Mr. Kevin

3-203, Shidai Jingyuan, fuyong, baoan, shenzhen, Guangdong

Contacter maintenant

La description

High Frequency PCB Rogers *0mil 1.**4mm RO***0B Double Sided RF Circuit Board Patch Antenna PCB

RO***0B hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to **0 MHz and above.

RO***0B material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO***0B material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials.

The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range.

RO***0B material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO***0B is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions.

The low Z-axis CTE of RO***0B provides reliable plated through-hole quality, even in severe thermal shock applications. RO***0B material has a Tg of >**0C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.

Parameters of a type of 1.6mm RO***0B PCB

PCB SIZE	5 x 5mm=1PCS
BOARD TYPE	High frequency PCB, RF PCB
Number of Layers	Double sided PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper *****- 5um(1oz)+PLATE
	RO**0B 0mil
	copper *****- 5um(1oz)+PLATE
TECHNOLOGY
Minimum Trace and Space:	1mil/2mil
Minimum / Maximum Holes:	0.3/2.2mm
Number of Different Holes:	5
Number of Drill Holes:	**4
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control	NO
BOARD MATERIAL
Glass Epoxy:	RO**0B 0mil, Tg **8â„ƒ
Final foil external:	1.5oz
Final foil internal:	0oz
Final height of PCB:	1.6mm ±0.*6
PLATING AND COATING
Surface Finish	Electroless nickel over Immersion Gold (ENIG)( 2 micoinch over **0 microinch nickel)
Solder Mask Apply To:	NO
Solder Mask Color:	NO
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	NO
Colour of Component Legend	NO
Manufacturer Name or Logo:	N/A
VIA	Plated Through Hole(PTH)
FLAMIBILITY RATING	UL **-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.**9" (0.5mm)
Board plating:	0.*0" (0.6mm)
Drill tolerance:	0.*2" (0.5mm)
TEST	**0% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS****-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Typical applications are as follows:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID

Data sheet (RO***0B )

RO***0B Typical Value
Property	RO***0B	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.8±0.5	Z		0 GHz/3â„ƒ	IPC-TM***0 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.*6	Z		8 to *0 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.*7 0.*1	Z		0 GHz/3â„ƒ 2.5 GHz/*3â„ƒ	IPC-TM***0 2.5.5.5
Thermal Coefficient of ε	**0	Z	ppm/â„ƒ	0â„ƒto 0â„ƒ	IPC-TM***0 2.5.5.5
Volume Resistivity	1.2 x ***0		MΩ.cm	COND A	IPC-TM**0 2.5.7.1
Surface Resistivity	5.7 x**9		MΩ	COND A	IPC-TM**0 2.5.7.1
Electrical Strength	1.2(*0)	Z	Kv/mm(v/mil)	0.1mm(0.*0")	IPC-TM***0 2.5.6.2
Tensile Modulus	6,7(2,2) 4,3(2,3)	X Y	MPa(ksi)	RT	ASTM D **8
Tensile Strength	*3(9.5) *0(8.9)	X Y	MPa(ksi)	RT	ASTM D **8
Flexural Strength	*5 (7)		MPa (kpsi)		IPC-TM***0 2.4.4
Dimensional Stability	<0.5	X,Y	mm/m (mil/inch)	after etch+E2/**0â„ƒ	IPC-TM**0 2.4.9A
Coefficient of Thermal Expansion	0 2 *2	X Y Z	ppm/â„ƒ	5â„ƒto8â„ƒ	IPC-TM**0 2.4.1
Tg	>**0		â„ƒ TMA	A	IPC-TM**0 2.4.4.3
Td	**0		â„ƒ TGA		ASTM D ***0
Thermal Conductivity	0.*9		W/M/oK	*0â„ƒ	ASTM C**8
Moisture Absorption	0.*6		%	8hrs immersion 0.0" sample Temperature 0â„ƒ	ASTM D **0
Density	1.*6		gm/cm3	*3â„ƒ	ASTM D **2
Copper Peel Stength	0.*8 (5.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM***0 2.4.8
Flammability	(3)V*0				UL *4
Lead-free Process Compatible	Yes

Pays:	China
N Â° de modÃ¨le:	BIC-001-V1.0
Prix FOB:	9 ~ 99 / Unit ( Negotiable ) (Negotiable) Obtenir le dernier prix
LocalitÃ©:	China
Prix de commande minimale:	9 per Unit
Commande minimale:	1 Piece
Packaging Detail:	vaccume
Heure de livraison:	10 working days
Capacité de Fournir:	50000 Piece per Month
Payment Type:	T/T
Groupe de produits :	-