Prix FOB
Obtenir le dernier prix|
- Minimum Order
Pays:
China
N ° de modèle:
copper foam, opencell copper, cu foam, porous copper, heat exchange
Prix FOB:
Localité:
-
Prix de commande minimale:
-
Commande minimale:
-
Packaging Detail:
-
Heure de livraison:
-
Capacité de Fournir:
-
Payment Type:
-
Groupe de produits :
-
Personne àcontacter First Name
Building 39,Zijingyuan Industrial Park,NO.301 Zonglv , Shanghai, Shanghai
The technology of producing copper foam by Shanghai Winfay New Material Co., Ltd is built on a lace microstructure which improves properties found in standard metal foams. It represents a new lightweight / high performance wick platform that solves some of the most critical thermal management challenges in the electronics ***** Foam are particularly fitted to replace the current copper powder-based wick structures used industry-wide in heat pipes and vapor chambers. Below is the conventional evaluation of copper foam made by Shanghai Winfay. Porosity: 5—**0 PPI (pores per inch) Density: 0.*5~0.*5g/cm3 Cavity: *0%—*8% Element: Cu+Ni, Cu+Al, Cu+Zn Volume: **0×**0×1—**0mm Feature: 1. Excellent mechanical property and processability; 2. Extraordinary electricity and heat conductivity; 3. Massive intricate, lattice-like inner structure 4. The excellent ability of corrosion resistance, superior tensile strength, favorable ductility; 5. Magnificent electromagnetic shielding ability. Special specification are available upon request.
| Pays: | China |
| N ° de modèle: | copper foam, opencell copper, cu foam, porous copper, heat exchange |
| Prix FOB: | Obtenir le dernier prix |
| Localité: | - |
| Prix de commande minimale: | - |
| Commande minimale: | - |
| Packaging Detail: | - |
| Heure de livraison: | - |
| Capacité de Fournir: | - |
| Payment Type: | - |
| Groupe de produits : | - |
