heat exchange, cooling for CPU, copper foam, opencell copper, cu foam By Shanghai Winfay New Material Co., Ltd,
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heat exchange, cooling for CPU, copper foam, opencell copper, cu foam

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copper foam, opencell copper, cu foam, porous copper, heat exchange

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Shanghai Winfay New Material Co., Ltd

Shanghai Winfay New Material Co., Ltd

China

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Building 39,Zijingyuan Industrial Park,NO.301 Zonglv , Shanghai, Shanghai

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Spécification du produit

La description

The technology of producing copper foam by Shanghai Winfay New Material Co., Ltd is built on a lace microstructure which improves properties found in standard metal foams. It represents a new lightweight / high performance wick platform that solves some of the most critical thermal management challenges in the electronics ***** Foam are particularly fitted to replace the current copper powder-based wick structures used industry-wide in heat pipes and vapor chambers. Below is the conventional evaluation of copper foam made by Shanghai Winfay. Porosity: 5—**0 PPI (pores per inch) Density: 0.*5~0.*5g/cm3 Cavity: *0%—*8% Element: Cu+Ni, Cu+Al, Cu+Zn Volume: **0×**0×1—**0mm Feature: 1. Excellent mechanical property and processability; 2. Extraordinary electricity and heat conductivity; 3. Massive intricate, lattice-like inner structure 4. The excellent ability of corrosion resistance, superior tensile strength, favorable ductility; 5. Magnificent electromagnetic shielding ability. Special specification are available upon request.

Pays: China
N ° de modèle: copper foam, opencell copper, cu foam, porous copper, heat exchange
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Mots-clés correspondants Shanghai Winfay New Material Co., Ltd

copper foam, opencell copper, cu foam, porous copper, heat exchange copper foam, opencell copper, cu foam, porous copper, heat exchange
nickel foam, ni foam, porous nickel, open-cell nickel nickel foam, ni foam, porous nickel, open-cell nickel
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