F23BDSM25-W1 WIFI+Bluetooth Module SDIO 2.4 150M RTL8723BS

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F23BDSM25-W1

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wifi module

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SpÃ©cification du produit

La description

F*3BDSM**-W1 is a small size and low profile of WiFi + BT Combo module with LGA (Land-Grid Array) footprint, board size is *2mm**2mm with module thickness of 2mm. It can be easily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides SDIO interface for WiFi to connect with host processor and high speed UART interface for BT. It also has a PCM interface for audio data transmission with direct link to external audio codec via BT controller. The WiFi throughput can go up to **0Mbps in theory by using 1x1 **2.*1n b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0.

F*3BSSM**-W1 uses Realtek RTL***3BS, a highly integrated WiFi/BT single chip based on advanced COMS process. RTL***3BS integrates whole WiFi/BT function blocks into a chip, such as SDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components remained on PCB. The general block diagram for the module is shown in Figure 1

Main Chipset

Realtek RTL***3BS-VD

Operating Frequency

2.**0ï½ž2.***5GHz

Standards

WiFi:

IEEE **2.*1b, IEEE **2.*1g, IEEE **2.*1n, IEEE **2.*1d, IEEE **2.*1e, IEEE **2.*1h, IEEE **2.*1i

BT:

V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0

Modulation

WiFi:

**2.*1b: CCK(*1, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps),

**2.*1 g/n: OFDM

BT:

8DPSK,π/4 DQPSK, GFSK

PHY Data rates

WiFi:

**2.*1b: *1,5.5,2,1 Mbps

**2.*1g:*4,*8,*6,*4,*8,*2,9,6 Mbps

**2.*1n: up to **0Mbps

BT:

1 Mbps for Basic Rate

2,3 Mbps for Enhanced Data Rate 6,9,*2,*8,*4,*6,*8,*4 Mbps for High Speed

Transmit Output Power(Tolerance:±2.0dBm)

WiFi:

*6dBm **2.*1g

Pays:	China
N Â° de modÃ¨le:	F23BDSM25-W1
Prix FOB:	(Negotiable) Obtenir le dernier prix
LocalitÃ©:	-
Prix de commande minimale:	-
Commande minimale:	-
Packaging Detail:	-
Heure de livraison:	-
Capacité de Fournir:	-
Payment Type:	-
Groupe de produits :	wifi module