Prix FOB
Obtenir le dernier prix|
20 Piece Minimum Order
Pays:
China
N ° de modèle:
DB118
Prix FOB:
Localité:
-
Prix de commande minimale:
-
Commande minimale:
20 Piece
Packaging Detail:
-
Heure de livraison:
-
Capacité de Fournir:
-
Payment Type:
-
Groupe de produits :
Personne àcontacter Ms. Docbond
628Jiushui East Road Laoshan District, Qingdao, Shandong
DB**8
This product is a one-component epoxy resin adhesive with high thermal  conductivity, which is the best matching adhesive for thermal bonding of  chips. Applicable to all kinds of electronic products, characterized by rapid  thermal curing, and easy to apply. Upon cure, it has high bonding strength,  good thermal conductivity, low shrinkage, low moisture absorption, good  insulation performance, etc., which can reduce the working temperature of the  chip, extend the life of the chip
| Pays: | China |
| N ° de modèle: | DB118 |
| Prix FOB: | Obtenir le dernier prix |
| Localité: | - |
| Prix de commande minimale: | - |
| Commande minimale: | 20 Piece |
| Packaging Detail: | - |
| Heure de livraison: | - |
| Capacité de Fournir: | - |
| Payment Type: | - |
| Groupe de produits : | Electronic glue |
