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China
N ° de modèle:
Copper Foam 1
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Personne àcontacter Mr. Vinson
Zonglv, shanghai, shanghai
The technology of producing copper foam by Shanghai Winfay
New Material Co., Ltdis built on a lace microstructure
which improves properties found in standard metal foams. It
represents a new lightweight / high performance wick platform that
solves some of the most critical thermal management challenges in
the electronics sector.Copper Foam are particularly fitted to
replace the current copper powder-based wick structures used
industry-wide in heat pipes and vapor chambers. Below is the
conventional evaluation of copper foam made by Shanghai Winfay.
Porosity: 5—**0 PPI (pores per inch)
Density:Â 0.*5~0.*5g/cm3
Cavity: *0%—*8%
Element:Â Cu+Ni, Cu+Al, Cu+Zn
Volume: **0×**0×1—**0mm Feature:
1. Excellent mechanical property and processability;
2. Extraordinary electricity and heat conductivity;
3. Massive intricate, lattice-like inner structure
4. The excellent ability of corrosion resistance, superior tensile
strength, favorable ductility;
5. Magnificent electromagnetic shielding ability. Special
specification are available upon request.
Â
| Pays: | China |
| N ° de modèle: | Copper Foam 1 |
| Prix FOB: | Obtenir le dernier prix |
| Localité: | - |
| Prix de commande minimale: | - |
| Commande minimale: | - |
| Packaging Detail: | - |
| Heure de livraison: | - |
| Capacité de Fournir: | - |
| Payment Type: | - |
| Groupe de produits : | - |
