Ceramic substrate, Ceramic PCB, ceramic metallization, AlN, Al2O3, direct plating copper, DPC, DBC, ceramic heating substrate, ceramic based pcb By Tensky International,
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Ceramic substrate, Ceramic PCB, ceramic metallization, AlN, Al2O3, direct plating copper, DPC, DBC, ceramic heating substrate, ceramic based pcb
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Ceramic substrate, Ceramic PCB, ceramic metallization, AlN, Al2O3, direct plating copper, DPC, DBC, ceramic heating substrate, ceramic based pcb

Prix FOB

Obtenir le dernier prix

( Negotiable )

|

- Minimum Order

Pays:

Taiwan

N ° de modèle:

LTCC3535, LTCC5050, 3535, 3028

Prix FOB:

( Negotiable ) Obtenir le dernier prix

Localité:

-

Prix de commande minimale:

-

Commande minimale:

-

Packaging Detail:

It depends on the actual design and different customized specifications

Heure de livraison:

-

Capacité de Fournir:

-

Payment Type:

Other, D/A, L/C, T/T

Groupe de produits :

Electrical/Ceramic Circuit Board

Contacter maintenant
Tensky International

Tensky International

Taiwan

Membre gratuit

Personne à contacter Mr. Reg

Jhongshan RD, Hsinchu, Hukou

Contacter maintenant

Spécification du produit

  • Type: Electrothermal Ceramics
  • Material: Alumina

La description

  • Model No.: LTCC***5,LTCC***0,***5,***8,
  • Made in Taiwan, ROC
  • Key Features
  •  

    Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit

     

    coating:0.**5um to 5mil

     

    Ceramic Metallized substrate:

     

    Al2O3 substrate metallized

     

    AlN substrate metallized

     

    Silicon wafer metallized

     

    LED heat-dissipation ceramic substrate:

     

    LED Al2O3 thin film substrate

     

    LED Al2O3 thick film substrate

     

    LED AlN thin film heat-dissipation substrate

     

    Flip chip substrate:

     

    The integration of the thin film,thick film,electrode plating and electroless plating processes



     

     

    Application:

     

    1. High Power LED ceramic substrate

     

    2. Microwave (Wireless Communication & Radar)

     

    3. Semiconductor Process Equipment

     

    4. Solar Cell

     

    5. Hybrid Electric Vehicles

     

    6.Flip chip/eutectic substrate

     

    7.Sensor ceramic substrate

Pays: Taiwan
N ° de modèle: LTCC3535, LTCC5050, 3535, 3028
Prix FOB: ( Negotiable ) Obtenir le dernier prix
Localité: -
Prix de commande minimale: -
Commande minimale: -
Packaging Detail: It depends on the actual design and different customized specifications
Heure de livraison: -
Capacité de Fournir: -
Payment Type: Other, D/A, L/C, T/T
Groupe de produits : Electrical/Ceramic Circuit Board

Mots-clés correspondants Tensky International

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Mots-clés correspondants

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