La description
is_customized:Yes
Brand Name:SIREDA
Model Number:**********8
Package:BGA
Pitch:0.5mm
Pin Count:**3
IC Size:*1.5X*3mm
Structure:Clamshell
Contact:Spring Probe
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BGA**3(eMMC) Socket SD Solution_*1.5X*3mm Premium
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The SD solution is designed for test, debug, validation, and
programming of eMMC, eMCP devices
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The SD solution provides a compact test solution for eMMC, eMCP
devices used in applications such as handheld, mobile, and TV
product development.Â
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Test, debug, validation, and programming of  eMMC, eMCP
devices
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Failure analysis / System and wafer test
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Package and Chip qualification
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Production prototype / Data recover
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Suitable for devices of  Samsung, Hynix, Sandisk, Toshiba,
Intel, Kingston etc eMMC and eMCP. Support eMMC version:
≤eMMC5.0. Support hot plug, eMMC can be directly connected to PC
with SD card reader. Realize reading, accessing and writting data
for eMMC and eMCP devices
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Mechanical
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Socket Body: PPS
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Socket Lid: Aluminum Alloy
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Contact: Spring Probe
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Operation Temperature: 0ºC to *0ºC
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Life Span at Operating Travel:*0K min.
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Cycles Spring Force:*4.5g per Pin
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Electrical
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Current Rating (Continuous) : 2A
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DC Resistance: **0mohm
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Place a Device by hand on to the socket. Lock the lid. Connect to
PC by SD Card Reader. Now it is ready for use.
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Unit Type: piece Package Weight: 0.**0kg (0.*1lb.) Package Size:
*2cm x *1cm x 9cm (4.*2in x 4.*3in x 3.*4in)
Pays: |
China |
N ° de modèle: |
-
|
Prix FOB: |
455 / Piece (Negotiable)
Obtenir le dernier prix
|
Localité: |
- |
Prix de commande minimale: |
455 per Piece |
Commande minimale: |
1 Piece |
Packaging Detail: |
- |
Heure de livraison: |
3-7 days |
Capacité de Fournir: |
- |
Payment Type: |
Other, PayPal, Western Union, L/C, T/T |
Groupe de produits : |
SD solution
|