La description

●Hot air header and mounting header are designed 2 in 1, and have both the auto soldering and mounting function; ●Color optical system with functions of split vision, zoom - in and micro-adjust, equipped with aberration detection device; with auto focus and software operation function, *2 times optical focus; able to rework BGA sized up to *0mm׷0mm; ●Touch screen interface, PLC control; able to display temperature curves and five detecting curves at the same time; ●Color LCD monitor; ●Build-in vacuum pump; **0? rotation in Φ angle; mounting nozzle is micro-adjustable; ●6 segments of temperature up (down) and 6 segments constant temperature control, *0 groups of temperature curve are stored; Cruve analysis can be carried out on the touch screen and has the communication function as computers , with software attached ●Able to arrive at three indepent temperature zone(the third is option), temperature and time can be displayed digitally on the touch screen;reworkable CCBGA ; ●The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area; ●Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range; ●Heaters can be moved in any location within the working area to fit for reworking BGA in different positions on PCB; ●Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep soldering effect; heating board is independent controlled; ●Epuipped with different Ti alloy hot air nozzles, easy to replace and able to locate in any angle. ●Driven by the stepping motor, the integrative hot air header can store *0 groups of different BGA heating points and register marks.