Prix FOB
Obtenir le dernier prix2 ~ 5 USD / Piece
|5 Piece Minimum Order
Pays:
China
N ° de modèle:
GPHC5.0
Prix FOB:
2 ~ 5 USD / Piece Obtenir le dernier prix
Localité:
USA
Prix de commande minimale:
2 per Piece
Commande minimale:
5 Piece
Packaging Detail:
box
Heure de livraison:
3 days
Capacité de Fournir:
100 Piece per Week
Payment Type:
T/T
Groupe de produits :
Personne àcontacter Carrie
Shenzhen, Guangdong
BERGQUISTÂ GAP PADÂ TGP HC***0 Formerly known as GAP
PADÂ HC 5.0
Highly Conformable, Thermally Conductive, Low-Modulus Material
BERGQUISTÂ GAP PADÂ HC5.0 is a soft and compliant gap
filling material
with a thermal conductivity of 5.0 W/m-K.The material offers
exceptional thermal
performance at low pressures due to a unique filler package and
low-modulus resin
formulation. The enhanced material is ideal for applications
requiring low stress on
components and boards during assembly.BERGQUISTÂ GPHC5.0
maintains a conformable nature that allows for excellent
interfacing and wet-out characteristics, even to surfaces with high
roughness and/or topography.
BERGQUISTÂ GAP PADÂ TGP HC***0 is offered with natural
inherent tack on both
sides of the material, eliminating the need for thermally-impeding
adhesive layers.
The top side has minimal tack for ease of handling. BERGQUISTÂ
GAP PADÂ TGP
HC***0 is supplied with protective liners on both sides.Â
| Pays: | China |
| N ° de modèle: | GPHC5.0 |
| Prix FOB: | 2 ~ 5 / Piece Obtenir le dernier prix |
| Localité: | USA |
| Prix de commande minimale: | 2 per Piece |
| Commande minimale: | 5 Piece |
| Packaging Detail: | box |
| Heure de livraison: | 3 days |
| Capacité de Fournir: | 100 Piece per Week |
| Payment Type: | T/T |
| Groupe de produits : | Berguist gap pad |
