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Amaoe A18 Middle Layer Reballing Stencil For iPhone 16 Series

Prix FOB

Obtenir le dernier prix

1.5 ~ 5 / Piece ( Negotiable )

1 Minimum Order

Pays:

Taiwan

N Â° de modÃ¨le:

Prix FOB:

1.5 ~ 5 / Piece ( Negotiable )(Negotiable) Obtenir le dernier prix

LocalitÃ©:

Prix de commande minimale:

1.5 per Piece

Commande minimale:

Packaging Detail:

carbon

Heure de livraison:

5-7days

Capacité de Fournir:

100 Piece per Year

Payment Type:

Groupe de produits :

Reballing Stencil

Contacter maintenant

Shenzhen ASAPFIX technology Co.,Ltd,

Taiwan

Membre gratuit

Personne Ã contacter Phonefix

Contacter maintenant

La description

Amaoe IP*6 A*8 BGA Reballing Stencil for iPhone *6/*6 Plus/*6 Pro/*6 Pro Max motherboard CPU/font/audio/power IC /USB control IC and iPhone *6 middle layer soldering repairs. High quality BGA reballing stencil comprehensive steel mesh for iPhone *6/*6 Pro Max middle layer frame/motherboard chip soldering.

Option:
1. Amaoe IP*6 A*8 Reballing Stencil (test version): comprehensive reballing stencil for iPhone *6/*6 Plus/*6 Pro/*6 Pro Max.
2. Amaoe IP*6 PL***2 reballing stencil (test version): for iPhone *6/*6 Plus middle layer frame soldering.
3. Amaoe IP*6 reballing stencil (test version): for iPhone *6 Pro/*6 Pro Max middle layer frame soldering.
Please note that the iPhone *6 series reballing stencil is currently only a test version and will be modified based on the actual motherboard situation.

Pays:	Taiwan
N Â° de modÃ¨le:	-
Prix FOB:	1.5 ~ 5 / Piece ( Negotiable ) (Negotiable) Obtenir le dernier prix
LocalitÃ©:	CN
Prix de commande minimale:	1.5 per Piece
Commande minimale:	1
Packaging Detail:	carbon
Heure de livraison:	5-7days
Capacité de Fournir:	100 Piece per Year
Payment Type:	-
Groupe de produits :	Reballing Stencil