Prix FOB
Obtenir le dernier prix|
10 Minimum Order
Pays:
China
N ° de modèle:
CUSTOMIZED
Prix FOB:
Localité:
CHINA
Prix de commande minimale:
-
Commande minimale:
10
Packaging Detail:
CUSTOMIZED
Heure de livraison:
CUSTOMIZED
Capacité de Fournir:
1000000
Payment Type:
Other, PayPal, Money Gram, Western Union, D/P, D/A, L/C, T/T
Groupe de produits :
-
Personne àcontacter Victoria
Xian, Shaanxi
AlSiC is ideal for this application because its CTE matches dielectric substrates, Ceramic Ball Grid Array (BGA), Low Temperature Co-fired Ceramic (LTCC) materials, and printed circuit boards, while also has high thermal conductivity. In addition, AlSiC's high strength and hardness also provide protection for integrated circuit devices during assembly. The low density of such materials also improve the reliability of devices under shock or vibration.
| Pays: | China |
| N ° de modèle: | CUSTOMIZED |
| Prix FOB: | Obtenir le dernier prix |
| Localité: | CHINA |
| Prix de commande minimale: | - |
| Commande minimale: | 10 |
| Packaging Detail: | CUSTOMIZED |
| Heure de livraison: | CUSTOMIZED |
| Capacité de Fournir: | 1000000 |
| Payment Type: | Other, PayPal, Money Gram, Western Union, D/P, D/A, L/C, T/T |
| Groupe de produits : | - |
