La description

Layers: 1 to *2
Board finished thicknesses: 0.2 to 7.0mm
Materials: FR*4, CEM*3, high TG, halogen-free FR4 and Rogers
Maximum finished board size: **0 x **0mm
Minimum hole size: *-mil (0.1mm)
Minimum trace width/space: 3.5/3.*-mil
Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold-plating, immersion silver, immersion tin and OSP
Copper thicknesses: 0.5 to 6oz
Solder mask colors: green, yellow, black, white, red and blue
Copper thickness in hole: >*8um
Inner packaging: plastic bag (vacuum packing)
Outline tolerance: ±0.*3mm
Hole size tolerance: (PTH) ±0.**6 and (NPTH) ±0.*5mm
With UL and TS****9:***2 marks
Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger
Profiling: punching, routing, V-cut and beveling
OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided