La description

ABLEBOND ***1lmisr4 is a single-component, low-viscosity conductive silver adhesive. Good rheological property, suitable for high speed die attach package, no drawing and trailing; High purity,

Widely used in the semiconductor industry is mainly used for semiconductor chip paste, suitable for all automatic machine high-speed dispensing, is currently the world's fastest speed out of a conductive silver adhesive.

Ingredient - silver epoxy resin

Appearance - silver paste

The density of 3.5 g/cm3

Viscosity of *5 ℃ *0 pa. S

The working life of *5 ℃ *8 HRS

Completely cure time **5 ℃ * *0 min

Chip stripping test *9kg

CTE PPM / *0 ℃

Thermal conductivity is 2.5 W/m.k

The volume resistance *5 ℃ Ohm - 0.***1 cm

Features: good rheological property, suitable for high-speed die attach package, no drawing and trailing; High purity, widely used in the semiconductor industry.

Storage life - *0 c * 6 up