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3G 10 Layers communication device PCB
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3G 10 Layers communication device PCB

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100 Piece Minimum Order

Pays:

China

N ° de modèle:

FEI

Prix FOB:

Localité:

Shenzhen, China

Prix de commande minimale:

-

Commande minimale:

100 Piece

Packaging Detail:

Vaccumn Packing

Heure de livraison:

2 months

Capacité de Fournir:

10000 Piece per Month

Payment Type:

T/T, Western Union, PayPal

Groupe de produits :

Contacter maintenant
Membre gratuit

Personne à contacter Ms. cherry

Gushu, Shenzhen, Guangdong

Contacter maintenant

La description

 

Product name:
3G *0 Layers communication device PCB
Base Material Type:
FR*4
Finished Board Thickness(mm):
1.0mm
Layers:
*0
surface finishing:
Immersion gold
Solder mask color:
green
Finished copper inner/outer thickness(um):
1OZ(inner)1OZ(outer)
Unite Size(mm):
*0X*0mm
Line width:
2.5mil/2.5mil
Min finished hole size:
φ 0.*0mm
impedance:
*0 Ω ±*0%
product application:
Industrial elevator system, digital video record (DVR) system, medical, computing, storage, instrumentation, traffic, industrial power, fire alarm, wireless communication, telecommunication, networking and house controller.

Pays: China
N ° de modèle: FEI
Prix FOB: Obtenir le dernier prix
Localité: Shenzhen, China
Prix de commande minimale: -
Commande minimale: 100 Piece
Packaging Detail: Vaccumn Packing
Heure de livraison: 2 months
Capacité de Fournir: 10000 Piece per Month
Payment Type: T/T, Western Union, PayPal
Groupe de produits : Printed Circuit Board

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To:

Ms. cherry < Shenzhen Tengyuxin Technology Co., Ltd >

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