Prix FOB
Obtenir le dernier prixUSD ( Negotiable )
|10 Piece Minimum Order
Pays:
China
N ° de modèle:
JTD
Prix FOB:
USD ( Negotiable ) Obtenir le dernier prix
Localité:
China
Prix de commande minimale:
-
Commande minimale:
10 Piece
Packaging Detail:
Each with vacuum bag, 20 pieces in a paper box and then packed in cartons
Heure de livraison:
10-30 days after order
Capacité de Fournir:
500 Piece per Week
Payment Type:
T/T, L/C
Groupe de produits :
-
Personne àcontacter Amanda
No.222 Weiqi Road Yueqing Economic Development Zone, Wenzhou, Zhejiang
  Copper bonding wire is a kind of material for inner lead with excellent electrical, thermal, mechanical properties and excellent chemical stability, mainly for key materials of semiconductor packaging( molding compound, solder ball, high-desity packaging substrate, conducting resin).
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Features of products:
 1. material costs: low
 2. electronical conductivity: 5.*8 *0E7/Ohm
 3. thermal conductivity: *9.5KW/m2kÂ
 4. mechanical properties: good
 5. stability: stable
 6. solder joint: relatively better
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Diameter(mm)
| 0.**8 | 0.**0 | 0.**3 | 0.**5 | 0.**8 | 0.**0 | 0.**2 | 0.**3 | 0.**8 | 0.**0 |
special order avaliable
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Copper Wire Physical Properties:
|
Resistivity |
1.**0**0*6 Ω.cm |
|
Density |
8.9g/cm3 |
|
Purity |
5N |
|
Pull(Φ*5μm) |
>7cN |
|
Arc height |
8mil |
|
Fusing current |
Same as usual copper bonding wire |
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Copper Bonding Wire Advantage:
1. Material costs: Low
2. Conductivity: 5.*8 *0 E7/Ohm Much thinner bonding wires during fine pitch packaging, Â
                        excellent performance of fine pitch(much smaller bonding pad), improving Â
                        current capacity and property of power regulating device.
3. Thermal conductivity: *9.5 KW/m2K
4. Mechanical properties: High mechanical property, larger tensile strength, better elongation, Â
                                        excellent ball collar strength and higher arc stability.
5. Stability: Stable-slow inter metallic growth rate, improving mechanical stability Â
                   and decreasing incremental resistance: moderate IMC growth enables Â
                   bonding strength to be improved.
6. Solder joint: Significantly reduced inter-metallic growth rate of solder joints. Resistance Â
                       reduced, heat production decreased, bonding reliability and device performance Â
                       improved. As the new products have their inter-metallic growth rate, resistance Â
                       and heat production lower than gold wire, the amount of resistance increase with Â
                       time and aging rete also is reduced.Â
| Pays: | China |
| N ° de modèle: | JTD |
| Prix FOB: | ( Negotiable ) Obtenir le dernier prix |
| Localité: | China |
| Prix de commande minimale: | - |
| Commande minimale: | 10 Piece |
| Packaging Detail: | Each with vacuum bag, 20 pieces in a paper box and then packed in cartons |
| Heure de livraison: | 10-30 days after order |
| Capacité de Fournir: | 500 Piece per Week |
| Payment Type: | T/T, L/C |
| Groupe de produits : | - |
