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China
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Prix de commande minimale:
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Personne àcontacter Hellen
Zhengzhou, Henan
Products Introduction
Resin binder having a good self-sharpening, sharp cutting, high grinding efficiency, workpiece surface roughness is low, less heat, easy to burn the workpiece, suitable for most workpiece materials efficiency, precision grinding and polishing.
The main target: the industry for LED sapphire wafer, the silicon wafer, GaAs, GaN wafer, glass and other products processing industry.
Material of workpiece: synthetic sapphire, Monocrystalline silicon, gallium arsenide and gallium nitride and other materials
Juchuang Abrasive offers a variety of resin bonded grinding wheel,
Diameter range: φ****0mm, wheel thickness: 0.****0mm, grit size: *0/**-w0.5, offer the special wheels as customers requirements.
| Pays: | China |
| N ° de modèle: | - |
| Prix FOB: | Obtenir le dernier prix |
| Localité: | - |
| Prix de commande minimale: | - |
| Commande minimale: | - |
| Packaging Detail: | - |
| Heure de livraison: | - |
| Capacité de Fournir: | - |
| Payment Type: | - |
| Groupe de produits : | - |
